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Packaging Group		 CCGA PWB Land Pattern
Pitch 1.0mm and 1.27mm
 
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Typical CCGA PC Board Land Pattern

     
Before Column Attach

Solder mask opening around via ring.

     

 After Column Attach

Fill vias to reduce fillet solder voids due to via outgassing.

     

 After Column Attach

View of CCGA corner.
        
 
 
Notes and Comments.
 

PCB BOARD DIMENSIONS ARE PRESENTED ONLY AS A GUIDELINE.
DESIGNERS SHOULD USE THEIR OWN EXPERIENCE WHEN DESIGNING PCB.

Vias should be filled to prevent outgassing during the reflow and assembly process.
Outgassing from vias will result in excessive voids in the fillet around the column.
The solderable column pad diameter is 1.2mils (30µm) smaller than the gerber design (1-oz Cu).

 
 
 
 
Comparison of pad dimensions for 1.0mm and 1.27mm Pitch   PDF
 
 
 
1.0mm Pitch
 
 
 
1.27mm Pitch
 
 
 
Board Order Number System
Board Nbr Board Size CGA Cu Pads SRO Mask Construction Finish
999014 5.5" x 8.0"
14 x 20cm		 CGA1752
Daisy Chain
DC427		 Cu Pad
Ø28mil
0.71mil		 SRO Ø33mil
0.81mil		 FR4 4L
Cu 3.7mil thick
Via in Pad		 ENIG
NiAu
999015 5.5" x 8.0"
14 x 20cm		 CGA1752
Daisy Chain
DC427		 Cu Pad
Ø28mil
0.71mil		 SRO Ø33mil
0.81mil		 FR4 4L
Cu 3.7mil thick
Via in Pad		 ENEPIG
NiPdAu
999016 5.5" x 8.0"
14 x 20cm		 BGA1752
Plastic
Daisy Chain
DC427		 Cu Pad
Ø20mil
0.50mil		 SRO Ø28mil
0.71mil		 FR4 4L
Cu 3.7mil thick
Via in Pad		 ENIG
NiAu
 
NASA GSFC-STD-6001:
IBM Solder Column: Pb90Sn10 2.21mm L x 0.51mm diameter and 1.62mm L x 0.89mm diameter.
Copper Wrapped Solder Column: Pb80Sn20, Sn-plated Cu Wrap, Sn63Pb37 Finish. 2.21mm L x 0.51mm diameter
 
Component Inspection:
Colpanarity: Less than +/-0.15mm (0.0059-inch)
Single Column Tilt: An individual column shall not be bent more than 5° relative to other columns
Multiple Column Tilt: Tilt is acceptable if all columns are tilted uniformally up to maximum 10°
Visual Inspection: Use 10X magnification
 
PWB Board Requirements:
PWB Board Material: Polyimide recommended due to lower CTE compared with epoxy-class boards.
PWB Allowed Finish: Tin-lead solder or Electroless-Nickel, Immersion Gold (ENIG). Maximum 0.254µm (10 micro-inch) gold.
PWB Prohibited Finish: Pure tin or other lead free surface plating is not allowed.
PWB Pad Diameter: Non-Solder Masked Defined pads (NSMD) minimum 120% of solder column diameter
PWB Component Courtyard: 0.3-inch (7.62mm) minimum clearance to allow sufficient clearance for rework.
 
Assembly Requirements:
Underfill: Not allowed under the CCGA component.
Solder Paste Stencil: Laser cut stencils are recommend, instead of chem-etched stencils.
 
Rework Requirements:
Prohibited Reuse of Columns: Columns shall not be reused even if they remain attached to the CCGA part after removal from the board.
 
Process Validation Testing:
Electrical Continuity: Use daisy chained connections at -55°C , +100°C and +25°C to identify a failed attachment.
 
ECCN: EAR99 Export Administration Regulations (EAR)
HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS
HS Code: 8311.30.3000 Lead-Tin Solders
ITAR: Solder columns and dummy daisy chain CCGA are not restricted.
 
 
        
 
 
 
 
 
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