Silicon Test Die
Wire Bondable
 
 
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Silicon Test Die
Variety of Wire Bondable Patterns
 
Quick Guide:  Copper (Cu) Wire Bonding  •   Gold (Au) Wire Bonding  •   Package Selector

 
Silicon Die with Daisy Chain
Nbr
Pads
Description Pad Size Size (mm) Die
Thickness
Metalization
over SiO2
Tray Qty Part Number Click Photo
to Enlarge
8 pairs Daisy Chain 60 x 160µm 1.0 x 1.0mm
250µm  Al 1.0µm 100 TD8-1.0-DC
151008 (A2)
16 pairs Daisy Chain
32 Wire Bonds
60 x 160µm 2.5 x 2.5mm
250µm  Al 1.0µm 100 TD16-2.5-DC
152516 (B2)
24 pairs Daisy Chain
48 Wire Bonds
60 x 360µm 4.0 x 4.0mm
250µm  Al 1.0µm 64 TD24-4.0-DC
154024 (C3)

8-Inch Wafer
174024


TD24~208
DWG 154000 ALL
46 pairs Daisy Chain
92 Wire Bonds
60 x 360µm 4.0 x 8.3mm
250µm
~725µm 
Al 1.0µm 64 TD46-4x8-BG725-DC
150046
52 pairs Daisy Chain
104 Wire Bonds
60 x 360µm 4.0 x 12.3mm
250µm
~725µm 
Al 1.0µm
36 TD52-4x12-BG725-DC
150052
64 pairs Daisy Chain
128 Wire Bonds
60 x 360µm 8.5 x 8.5mm
250µm
~725µm 
Al 1.0µm 49 TD64-8-BG725-DC
150064
66 pairs Daisy Chain
132 Wire Bonds
60 x 360µm 8.2 x 12.5mm
250µm
~725µm 
Al 1.0µm 36 TD66-8x12-BG725-DC
154066
80 pairs Daisy Chain
160 Wire Bonds
60 x 360µm 12.856 x 12.856mm
250µm
~725µm 
Al 1.0µm 36 TD80-12.5-BG725-DC
154080
94 pairs Daisy Chain
188 Wire Bonds
60 x 360µm 12.5 x 16.5mm
250µm
~725µm 
Al 1.0µm 16 TD94-12x16-BG725-DC
154094
108 pairs Daisy Chain
216 Wire Bonds
60 x 360µm 16.5 x 16.5mm
250µm
~725µm 
Al 1.0µm 16 TD108-16-BG725-DC
154108
122 pairs Daisy Chain
244 Wire Bonds
60 x 360µm 16.5 x 21mm
250µm
~725µm 
Al 1.0µm 9 TD122-16x20-BG725-DC
150122
136 pairs
Rev A
Daisy Chain
272 Wire Bonds
60 x 360µm 16.5 x 25mm
250µm
~725µm 
Al 1.0µm 9 TD136A-16x25-BG725-DC
150136A
136 pairs
Rev B
Daisy Chain
272 Wire Bonds
60 x 360µm 21 x 21mm
250µm
~725µm 
Al 1.0µm 9 TD136B-21x21-BG725-DC
150136A
150 pairs Daisy Chain
300 Wire Bonds
60 x 360µm 21 x 24.8mm
250µm
~725µm 
Al 1.0µm 9 TD150-21x25-BG725-DC
154164
164 pairs Daisy Chain
328 Wire Bonds
60 x 360µm 24.8 x 24.8mm
250µm
~725µm 
Al 1.0µm 9 TD164-25x25-BG725-DC
154164
 
Silicon Die with Sqaure Pads
Nbr
Pads
Description Pad Size Size (mm) Die
Thickness
Metalization
over SiO2
Tray Qty Part Number Click Photo
to Enlarge
16 Square Pad 60µm SQ. 1.0 x1.0mm
250µm  Al 1.0µm
Ti 300Å
100 TD16-1.0-ISO
151016 (A1)
32 Square Pad 60µm SQ. 2.5 x 2.5mm
250µm  Al 1.0µm
Ti 300Å
100 TD32-2.5-ISO
152533 (B1)
48 Square Pad 60µm SQ. 4.0 x 4.0mm
250µm  Al 1.0µm
Ti 300Å
64pc 2" tray
196pc 4" Tray
TD48-4.0-ISO
154048 (C1)
48 Square Pad 100µm SQ. 4.1 x 4.1mm
250µm  Al 1.0µm
Ti 300Å
64pc 2" tray
196pc 4" Tray
TD48-4.1-BG250
2" tray 254148
4" tray 254148

Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 244148
72 Square Pad 100µm SQ. 4.1 x 8.3mm
250µm  Al 1.0µm
Ti 300Å
Ask TD72-4.1x8.3-BG250
4" tray 204172

Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 244172
96 Square Pad 100µm SQ. 8.3 x 8.3mm
250µm  Al 1.0µm
Ti 300Å
49 TD96-8.3-BG250
4" tray 208296

Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 248296
120 Square Pad 100µm SQ. 8.3x 12.5mm
250µm  Al 1.0µm
Ti 300Å
Ask TD120-8.3x12.5-BG250
4" tray 204120

Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 244120
144 Square Pad 100µm SQ. 12.5 x 12.5mm
250µm  Al 1.0µm
Ti 300Å
36 TD144-12.5-BG250
4" tray 204144

Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 244144
168 Square Pad 100µm SQ. 12.5 x 16.7mm
250µm  Al 1.0µm
Ti 300Å
Ask TD168-12.5x16.7-BG250
4" tray 204168

Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 244168
192 Square Pad 100µm SQ. 16.7 x 16.7mm
250µm  Al 1.0µm
Ti 300Å
16 TD192-16.7-BG250
4" tray 204192

Unsawn 8" Wafer 174148
Sawn 8" BG Wafer 244192
 
 
Silicon Die with Differential Pairs for RF/Microwave Parasitic Test
Nbr
Pads
Description Pad Size Size (mm) Die
Thickness
Metalization
over SiO2
Tray Qty Part Number Click Photo
to Enlarge
2 Pads
With Ground
Differential
Pair
Pad 60 x 160µm
Ground Plane
1000µm SQ.
1.0 x1.0mm
250µm  Al 1.0µm
Ti 300Å
100 TD2-1.0-DIF
151002 (A3)
2 Pads
With Ground
Differential
Pair
Pad 60 x 160µm
Ground Plane
2500µm SQ.
2.5 x 2.5mm
250µm  Al 1.0µm
Ti 300Å
100 TD2-2.5-DIF
152502 (B3)
2 Pads
With Ground
Differential
Pair
Pad 60 x 160µm
Ground Plane
4000µm SQ.
4.0 x 4.0mm
250µm  Al 1.0µm
Ti 300Å
64 TD2-4.0-DIF
151002 (A3)
 
 
Silicon Die with Full Metallization
Nbr
Pads
Description Pad Size Size (mm) Die
Thickness
Metalization
over SiO2
Tray Qty Part Number Click Photo
to Enlarge
1 Large Pad Fully Metallized 1000µm SQ. 1.0 x1.0mm
250µm  Al 1.0µm
Ti 300Å
100 TD1-1.0-BG250-W
151001 (A4)
1 Large Pad Fully Metallized 1000µm SQ. 1.0 x1.0mm
508µm  Al 1.0µm
Ti 300Å
100~400 TD1-1.0-BG508-W
251001
1 Large Pad Fully Metallized 1000µm SQ. 1.0 x1.0mm
508µm  Au 1.0µm
Ti 200Å
100~400 TD1-1.0-Au-BG508-W
351001
1 Large Pad Fully Metallized 1000µm SQ. 1.0 x1.0mm
508µm  Au 1.0µm
Ti 200Å
4000
4" wafer
TD1-1.0-Au-BG508-NH4
361001
1 Large Pad Fully Metallized 1500µm SQ. 1.5 x1.5mm
508µm  Al 1.0µm
Ti 300Å
100~169 TD1-1.5-BG508-W
251501
1 Large Pad Fully Metallized 2000µm SQ. 2.0 x2.0mm
508µm  Al 1.0µm
Ti 300Å
100 TD1-2.0-BG508-W
152001
1 Large Pad Fully Metallized 2000µm SQ. 2.0 x2.0mm
508µm  Au 1.0µm
Ti 200Å
100 TD1-2.0-Au-BG508-W
352001
1 Large Pad Fully Metallized 2000µm SQ. 2.0 x2.0mm
508µm  Au 1.0µm
Ti 200Å
1500
4" Wafer
TD1-2.0-Au-BG508-NH4
362001
1 Large Pad Fully Metallized 2500µm SQ. 2.5 x 2.5mm
250µm  Al 1.0µm
Ti 300Å
100 TD1-2.5-BG250-W
152501 (B4)
1 Large Pad Fully Metallized 2500µm SQ. 2.5 x 2.5mm
508µm  Al 1.0µm
Ti 300Å
100 TD1-2.5-BG508-W
252501
1 Large Pad Fully Metallized 3000µm SQ. 3.0 x 3.0mm
508µm  Al 1.0µm
Ti 300Å
100 TD1-3.0-BG508-W
153001
1 Large Pad Fully Metallized 4000µm SQ. 4.0 x 4.0mm
250µm  Al 1.0µm
Ti 300Å
64 TD1-4.0-BG250-W
154001 (C4)
1 Large Pad Fully Metallized 4000µm SQ. 4.0 x 4.0mm
250µm  Al 1.0µm
Ti 300Å
1500
8" Wafer
TD1-4.0-BG250-NH8
244001
1 Large Pad Fully Metallized 5000µm SQ. 5.0 x 5.0mm
508µm  Al 1.0µm
Ti 300Å
144 TD1-5.0-BG508-P
105001
1 Large Pad Fully Metallized 5000µm SQ. 5.0 x 5.0mm
250µm  Al 1.0µm
Ti 300Å
1000
8" Wafer
TD1-5.0-BG250-NH8
245001
1 Large Pad Fully Metallized 5000µm SQ. 5.0 x 5.0mm
508µm  Al 1.0µm
Ti 300Å
1000
8" Wafer
TD1-5.0-BG2508-NH8
145001
1 Large Pad Fully Metallized 6000µm SQ. 6.0 x 6.0mm
200~
725µm 
Al 1.0µm
Ti 300Å
121 TD1-6.0-BG508-P
106001
1 Large Pad Fully Metallized 7000µm SQ. 7.0 x 7.0mm
200~
725µm 
Al 1.0µm
Ti 300Å
81 TD1-7.0-BG508-P
107001
1 Large Pad Fully Metallized 8000µm SQ. 8.0 x 8.0mm
200~
725µm 
Al 1.0µm
Ti 300Å
64 TD1-8.0-BG508-P
108001
1 Large Pad Fully Metallized 10000µm SQ. 10.0 x 10.0mm
200~
725µm 
Al 1.0µm
Ti 300Å
49 TD1-10.0-BG508-P
109901
1 Large Pad Fully Metallized 12000µm SQ. 12.0 x 12.0mm
200~
725µm 
Al 1.0µm
Ti 300Å
36 TD1-12.0-BG508-P
209201
1 Large Pad Fully Metallized 15000µm SQ. 15.0 x 15.0mm
200~
725µm 
Al 1.0µm
Ti 300Å
25 TD1-15.0-BG508-P
209501
Back grind die thickness 200~725um.
Rectangular die available  • Custom pad sizes and geometries available.
Packaging Suffix: 2" Waffle Pack (W) • 4" Waffle Pack (P)  • Wafer Ring (NT8) • Tape and Reel (E) • JEDEC Tray (T)

Conductive Metallization available: Al, AlS, Al-Si-Cu, Al-Cu, Al-Si, Cu, Ru, Pd, Pt, Au, Ag, Ni, Co, a-Si, and NiSi
Refractory Metallization available: Ta, TaN, Ti, TiN, TiW, W, WN, WSi, Cr
 
 
Silicon Die with 3-Rows of Bonding Pads
Total I/O
Pads
Perimeter
Rows
Pad Size
µm
Size (mm) Die
Thickness
Metalization
over SiO2
Tray Qty Part Number Click Photo
to Enlarge
380 3-Rows 50SQ,90SQ
175x55
5x3.25mm
300,500,750µm Al 1.0µm 144 TD380-5x3.2-BG300P
TD380-5x3.2-BG500P
TD380-5x3.2-BG750P
525 3-Rows 50SQ,90SQ
175x55
5x6.5mm
300,500,750µm Al 1.0µm 121 TD525-5x6.5-BG750P
670 3-Rows 50SQ,90SQ
175x55
5x10mm
300,500,750µm Al 1.0µm TBA TD670-5x10-BG750P
815 3-Rows 50SQ,90SQ
175x55
5x13mm
300,500,750µm Al 1.0µm TBA TD815-5x13-BG750P
960 3-Rows 50SQ,90SQ
175x55
5x16mm
300,500,750µm Al 1.0µm TBA TD960-5x16-BG750P
615 3-Rows 50SQ,90SQ
175x55
10x3.25mm
300,500,750µm Al 1.0µm TBA TD615-10x3.2-BG750P
760 3-Rows 50SQ,90SQ
175x55
10x6.5mm
300,500,750µm Al 1.0µm 49 TD760-10x6.5-BG750P
905 3-Rows 50SQ,90SQ
175x55
10x9.75mm
300,500,750µm Al 1.0µm 49 TD905-10x10-BG750P
1050 3-Rows 50SQ,90SQ
175x55
10x13mm
300,500,750µm Al 1.0µm 25 TD1050-10x13-BG750P
1195 3-Rows 50SQ,90SQ
175x55
10x16mm
300,500,750µm Al 1.0µm TBA TD1195-10x16-BG750P
1340 3-Rows 50SQ,90SQ
175x55
10x19mm
300,500,750µm Al 1.0µm TBA TD1340-10x19-BG750P
995 3-Rows 50SQ,90SQ
175x55
15x6.5mm
300,500,750µm Al 1.0µm TBA TD995-15x6.5-BG750P
1140 3-Rows 50SQ,90SQ
175x55
15x9.75mm
300,500,750µm Al 1.0µm 25 TD1140-15x10-BG750P
1285 3-Rows 50SQ,90SQ
175x55
15x13mm
300,500,750µm Al 1.0µm 25 TD1285-15x13-BG750P
1430 3-Rows 50SQ,90SQ
175x55
15x16mm
300,500,750µm Al 1.0µm 16 TD1430-15x16-BG750P
1575 3-Rows 50SQ,90SQ
175x55
15x19mm
300,500,750µm Al 1.0µm 16 TD1575-15x19-BG750P
1520 3-Rows 50SQ,90SQ
175x55
20x13mm
300,500,750µm Al 1.0µm 9 TD1520-20x13-BG750P
1665 3-Rows 50SQ,90SQ
175x55
20x16mm
300,500,750µm Al 1.0µm 9 TD1665-20x16-BG750P
1810 3-Rows 50SQ,90SQ
175x55
20x19mm
300,500,750µm Al 1.0µm 9 TD1810-20x19-BG750P
1950 3-Rows 50SQ,90SQ
175x55
20x23mm
300,500,750µm Al 1.0µm 9 TD1950-20x23-BG750P
1750 3-Rows 50SQ,90SQ
175x55
25x13mm
300,500,750µm Al 1.0µm TBA TD1750-25x13-BG750P
1900 3-Rows 50SQ,90SQ
175x55
25x16mm
300,500,750µm Al 1.0µm TBA TD1900-25x16-BG750P
2050 3-Rows 50SQ,90SQ
175x55
25x19mm
300,500,750µm Al 1.0µm TBA TD2050-25x19-BG750P
2200 3-Rows 50SQ,90SQ
175x55
25x23mm
300,500,750µm Al 1.0µm 9 TD2200-25x23-BG750P
2300 3-Rows 50SQ,90SQ
175x55
25x26mm
300,500,750µm Al 1.0µm 9 TD2300-25x26-BG750P
Back grind die thickness 250~750um.
Seed Layer Ti 300Å
Other Sizes available  • Custom pad sizes and geometries available.
Packaging Suffix: 2" Waffle Pack (W) • 4" Waffle Pack (P)  • Wafer Ring (NT12) • Tape and Reel (E) • JEDEC Tray (T)

Conductive Metallization available: Al, AlS, Al-Si-Cu, Al-Cu, Al-Si, Cu, Ru, Pd, Pt, Au, Ag, Ni, Co, a-Si, and NiSi
Refractory Metallization available: Ta, TaN, Ti, TiN, TiW, W, WN, WSi, Cr
 
 
JEDEC Moisture Sensitivity Level MSL-1
 
About Dielectric Materials:
Silicon-dioxide insulator SiO2 k = 4.2 • Application: Gold and aluminum wire bonding
Low-k Dielectric k < 3.0 • Application: Copper wire bonding and ultra-fine pitch pads < 90nm

Competing Low-k process technologies:
1) Chemical vapor deposited (CVD) inorganic films such as carbon-doped oxides (SiOC) k~2.8
2) Spun-on dielectrics (SOD) - polymer organic films k 2.5~2.8

Challenge of bonding to pads with Low-k dielectrics:
Spongy dielectric underlayer layer causes top metallization layer to cup and deflect, thus lowering optimal bondability.
Package Selector
Test Die Part Numbering System
TD 16 - 2.5 - DC - BG250 W
Die Type Nbr Pads   Die Size (mm)   Patterns   Backgrind
Option
Packaging
Options
TD=Singulated Die

TDW = Sawn Wafer

TDWU = Unsawn Wafer

FA = Full Array
Single Die
1=Fully Plated

2=Differential Pair

3~999=Bond Pads
  Square Example
1.0 = 1.0x1.0mm
2.5 = 2.5x2.5mm
4.0 = 4.0x4.0mm
Other sizes available


Rectangular Example:
5x3= X5mm x Y3mm
3x5= X3mm x Y5mm
Other sizes available
  DC = Daisy Chain

BUS = Fully Plated

ISO = Isolated Pads

DIF = Differential Pair

FA = Full Array

Blank = Isolated
or Fully Plated
  BG### = um thickness

Example:
BG250 = 250um = 10mils

Blank = Undefined
Single Die:
W = 2" Waffle Pack
P = 4" Waffle Pack
T = JEDEC Tray
E = Tape & Reel

Unsawn Wafer:
C = Cassette
J = Jar/Canister

Sawn Wafer:
NH8 = Plastic Hoop 8" Ring (Non-UV)
UH8 = Plastic Hooop 8" Ring (UV Tape)
NT8 = Dicing Tape 8" Ring
NH8 = Plastic Hoop 8" Ring
NT12 = Dicing Tape 12" Ring
UV8 = UV Tape 8" Ring
UV12 = UV Tape 12" Ring
Aluminum Pads: 1st Layer: SiO2 - 3000Å   •   2nd Layer: Ti - 300Å thick   •   3rd Layer: Al - 1.0µm thick  •   ( 1.0µm = 10000Å = 10KÅ)
Copper and other pad platings available
DBG: Dice before Gring process available for thin die 50um and 100um thick.
Dimensional tolerance: ±5um and ±10um available on request.
Die Daisy Chain Numbering System
   1       5       10       08   
Variations Packaging Size I/O
1 = Standard

2~9 = Variations
Thickness
Plating
Materials
etc.
Single Die:
0 = 4" Waffle Tray (P)
5 = 2" Waffle Tray (W)


Sawn Wafer Disco DTF-2-8-1 Format:
3 = UV Tape & Metal Frame ("UD") FF108  •   FF123
4 = Non-UV & Metal Frame ("ND") FF108  •   FF123
2 = Non-UV & Plastic Frame ("PD") FFP7290-11

Sawn Wafer K&S 350-104 Format:
1 = UV Tape & Metal Frame ("UK") FF105  •   FF123
8 = Non-UV & Metal Frame ("NK") FF105  •   FF123
9 = Non-UV & Plastic Frame ("PK") FFP7290-14

6 = Non-UV Wafer Expansion Hoops ("H")

Unsawn Wafer Format:
7 = Clam Shell, Jar, etc
10 = 1.0x1.0mm

25 = 2.5x2.5mm

40 = 4.0x4.0mm

Other Sizes Available
01 = 1 pad

08 = 8 pads
16 = 16 pads
24 = 24 pads
48 = 48 pads
99 = 100 pads
 
 
 
        
 
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TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv

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