|C7 Series TOOL-KIT
|Graphite structure with array of holes to match CCGA pads. Holds columns upright. Bottom side has downset to clear solder paste fillets. Top side has receptacle to accept optional Flip-Pack® U.S. Patents D808350 S.
|Adjustable X/Y stage holds and aligns LGA/CCGA substrate pads. Channels permit optional thermocouples to measure temperature at substrate during reflow. Vacuum center hole prevents substrate from lifting. Patent Pending.
|Base has ultra-fine threaded adjustment to align the stage in X/Y directions. Includes 3 precision alignment pins. The C7-BASE sits on top of vacuum chuck to secure the substrate in the stage. Patent pending.
|Array of Titanium (Ti) pins gently pushes solder columns uniformly into solder paste on substrate.
|Precision dowel pins safely lifts CCGA substrate by 4-corners from the Graphite top plate after reflow.
|Essential tool for centering and accurate X/Y Theta alignment of LGA in graphite. Includes precision alignment template with aperture allowing annular ring vision of LGA pads while seated in graphite.
|Set of laser cut stainless steel stencils with a choice of apertures for optimizing solder paste volume. Micro-etched stencil surface with nano-coating assures clean solder paste deposits to LGA seated in Graphite Set.
|Simple to use manual stencil printer for applying solder paste while LGA sits in graphite. Adjustable spring back for clean solder paste deposits. Includes stainless steel stencils and metal doctor blade squeegee.
|Securely holds and protects CCGA while planarizing Solder Columns using fine-grit silicon carbide lapping media and diamond polishing film of your selection. Includes precision machined brass plate and two step shims. Not required for Micro-coil springs.
|Simple to use tool to extract CCGA from Planarizing tool. Gently lifts substrate at 4-corners with precision dowel pins.
|Note 1: Consult with TopLine for recommended tools for your application.