BGA & CSP
 
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BGA and CSP


0.3mm pitch WLP - Wafer Level Package
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
196 14x14 0.3mm 4.2mm
Si 196 - WLP196T.3C-DC148D
256 16x16 0.3mm 4.8mm
Si 144 - WLP256T.3C-DC168D   360 ° Model
264 17x17
6-row
0.3mm 6mm
Si 121 - WLP264T.3C-DC173D
400 20x20 0.3mm 6mm
Si 121 - WLP400T.3C-DC208D   360 ° Model
676 26x26 0.3mm 7.8mm
Si 64 - WLP676T.3C-DC260D
SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: WLP400T.3C-DC208
WLP series silicon wafer level substrate. 0.20mm diameter SAC305 solder Ball Sn96.5/Ag3.0/Cu0.5
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
 
0.4mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
97 10x100 0.4mm 5mm
BT 624 - BGA97T.4C-DC107D   360 ° Model
100 10x10 0.4mm 4mm
Si 196 - WLP100T.4C-DC108D
144 13x13
4-Row
0.4mm 6mm
Si 121 - WLP144T.4C-DC133D
196 14x14 0.4mm 5.6mm
Si 121 - WLP196T.4C-DC148D
256 16x16 0.4mm 6.4mm
Si 81 - WLP256T.4C-DC168D   360 ° Model
360 23x23
5-Row
0.4mm 10mm
BT 250 - BGA360T.4C-DC235D   360 ° Model
400 20x20 0.4mm 8mm
Si 64 - WLP400T.4C-DC208D   360 ° Model
400 20x20 0.4mm 10mm
FR4 240/250 BGA400T.4-DC209 BGA400T.4C-DC209   360 ° Model
432 31x31
4-Row
0.4mm 13mm
BT 160 - BGA432T.4C-DC313D   360 ° Model
625 25x25 0.4mm 12mm
FR4 189 BGA625T.4-DC259 BGA625T.4C-DC259   360 ° Model
900 30x30 0.4mm 15mm
FR4 126 BGA900T.4-DC309 BGA900T.4C-DC309   360 ° Model
2025 45x45 0.4mm 21mm
FR4 60 LBGA2025T.4-DC459D LBGA2025T.4C-DC459D
3600 60x60 0.4mm 27mm
FR4 40 LBGA3600T.4-DC609 LBGA3600T.4C-DC609
6400 80x80 0.4mm 35mm
FR4 24 LBGA6400T.4-DC809 LBGA6400T.4C-DC809
10,000 100x100 0.4mm 42.5mm
FR4 12 LBGA10000T.4-BUS LBGA10000T.4C-BUS
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: LBGA2025T.5C-DC459
Dummy Die: Add  "D" to end of part number.     Example: LBGA2025T.4-DC459D
WLP series silicon wafer level substrate. 0.26mm diameter SAC305 solder Ball Sn96.5/Ag3.0/Cu0.5
Depopulated "perimeter" row versions are available instead of "full" array.
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
 
0.5mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
6 2x3 0.5mm 1.5 x 1.0mm Si Reel CSP6E7A.5-DC023 CSP6E7A.5C-DC023
16 4x4 0.5mm 2mm
Si Reel - WLP16E.5C-DC048D   360 ° Model
36 6x6 0.5mm 3mm
Si Reel - WLP36E.5C-DC067D   360 ° Model
40 8x8
2-Row
0.5mm 5mm BT 624 CSP40T.5-DC082 CSP40T.5C-DC082
56 10x10
2-Row
0.5mm 6mm BT 608 CSP56T.5-DC102 CSP56T.5C-DC102
64 8x8 0.5mm 4mm
Si 196 - WLP64T.5C-DC088D   360 ° Model
84 10x10
3-Row
0.5mm 6mm BT 608 CSP84T.5-DC104 CSP84T.5C-DC104
84 12x12
3-Row
0.5mm 7mm BT 476 CSP84T.5-DC123 CSP84T.5C-DC123
96 14x14
2-Row
0.5mm 8mm Pi 360 fBGA96T.5-DC144 fBGA96T.5C-DC144
100 10x10 0.5mm 5mm
Si 144 - WLP100T.5C-DC108D   360 ° Model
108 12x12
3-Row
0.5mm 7mm BT 476 CSP108T.5-DC124 CSP108T.5C-DC124
112 11x11
4-Row
0.5mm 6mm
Si 121 - WLP112T.5C-DC113D
132 14x14
3-Row
0.5mm 8mm BT 360 CSP132T.5-DC145 CSP132T.5C-DC145
144 12x12 0.5mm 6mm
Si 121 - WLP144T.5C-DC127D   360 ° Model
196 14x14 0.5mm 7mm
Si 81 - WLP196T.5C-DC148D   360 ° Model
228 22x22
3-Row
0.5mm 12mm FR4 189 LBGA228T.5-DC222 LBGA228T.5C-DC222
[LBGA228T.5C-DC222B]
256 16x16 0.5mm 8mm
Si 64 - WLP256T.5C-DC168D   360 ° Model
288 22x22
4-Row
0.5mm 12mm FR4 189 LBGA288T.5-DC221 LBGA288T.5C-DC221
400 20x20 0.5mm 10mm
Si 49 - WLP400T.5C-DC208D   360 ° Model
400 20x20 0.5mm 12mm
BT 189/198 BGA400T.5-DC209 BGA400T.5C-DC209   360 ° Model
484 22x22 0.5mm 12mm FR4 189 LBGA484T.5-DC229A LBGA484T.5C-DC229A
[LBGA484T.5C-DC229B]
625 25x25 0.5mm 15mm
BT 126 BGA625T.5-DC259 BGA625T.5C-DC259   360 ° Model
676 26x26 0.5mm 13mm
Si 36 - WLP676T.5C-DC260D   360 ° Model
676 26x26 0.5mm 15mm FR4 126 LBGA676T.5-DC269 LBGA676T.5C-DC269
900 30x30 0.5mm 15mm
Si 25 - WLP900T.5C-DC307D   360 ° Model
900 30x30 0.5mm 17mm
BT 90 BGA900T.5-DC309 BGA900T.5C-DC309   360 ° Model
2025 45x45 0.5mm 25mm BT 44 LBGA2025T.5-DC459D LBGA2025T.5C-DC459D
2025 45x45 0.5mm 25mm FR4 44 LBGA2025T.5-BUS LBGA2025T.5C-BUS
3600 60x60 0.5mm 32.5mm FR4 24 LBGA3600T.5-DC609 LBGA3600T.5C-DC609
6400 80x80 0.5mm 42.5mm FR4 12 LBGA6400T.5-DC809 LBGA6400T.5C-DC809
10,000 100x100 0.5mm 52.5mm FR4 10 LBGA10000T.5-BUS LBGA10000T.5C-BUS
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: CSP56T.5C-DC102
Dummy Die: Add  "D" to end of part number.     Example: CSP56T.5-DC102D
WLP series silicon wafer level substrate. 0.31mm diameter SAC305 solder Ball Sn96.5/Ag3.0/Cu0.5
Depopulated "perimeter" row versions are available instead of "full" array.
Download Solidworks® e-Drawings software to view rotatable:    PC Version  •  Mac Version
 
 
0.65mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
4 2x2 0.65mm 1.0 x 0.5mm
Si Reel CSP4E7A.65-DC022 -
336 20x20
6-Row
0.65mm 14mm
Pi 119 BGA336T.65-D -
336 20x20
6-Row
0.65mm 15mm
FR4 126 BGA336T.65-DC203 BGA336T.65C-DC203   360 ° Model
400 20x20
Full
0.65mm 15mm
FR4 126 BGA400T.65-DC209 BGA400T.65C-DC209   360 ° Model
2025 45x45
Full
0.65mm 32.5mm
BT 24 LBGA2025T.65-DC459D LBGA2025T.65C-DC459D
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: LBGA2025T.65C-DC459
Dummy Die: Add  "D" to end of part number.     Example: LBGA2025T.65-DC459D
Depopulated "perimeter" row versions are available instead of "full" array.
Download Solidworks® e-Drawings viewer for rotatable models: PC Version  •  Mac Version
 
 
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0.75mm Pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
46 6x8
Full
0.75mm 6 x 7mm BT 160 BGA46T.75-DC24 BGA46T.75C-DC24
48 6x8
Full
0.75mm 6 x 7mm BT 480 BGA48T.75-6x8B BGA48T.75C-6x8B
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: BGA46T.75C-DC24
Dummy Die: Add  "D" to end of part number.     Example: BGA46T.75-DC24D
 
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0.8mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
36 6x6
Full
0.8mm 6 x 6mm BT 608 BGA36T.8-DC069 BGA36T.8C-DC069
48 6x8
Full
0.8mm 8 x 9mm FR4 297 LBGA48T.8-DC689 LBGA48T.8C-DC689
48 6x8
Full
0.8mm 8mm BT 80 BGA48T.8-DIE-6x8 -
49 7x7
Full
0.8mm 7mm BT 476
429
BGA49T.8-DC077
BGA49T.8-D
-
49 7x7
Full
0.8mm 6mm BT 429 - BGA49T.8C-DC077
BGA49T.8C-ISO
64 8x8
Full
0.8mm 8mm BT 319 BGA64T.8-DC089 BGA64T.8C-DC089
81 9x9
Full
0.8mm 8mm BT 360 BGA81T.8-DC099 BGA81T.8C-DC099
84 6x15
DDR2
0.8mm 8x14mm FR4 228 LBGA84T.8-DC656 LBGA84T.8C-DC656
84 6x15
DDR2
0.8mm 10x12.5mm FR4 136 LBGA84T.8-DC654 LBGA84T.8C-DC654
84 6x15
DDR2
0.8mm 12x12.5mm FR4 180 BGA84T.8-DC655 BGA84T.8C-DC655   360 ° Model
100 10x10
Full
0.8mm 10mm BT 250 BGA100T.8-DC109 BGA100T.8C-DC109
100 11x11
4-Row
0.8mm 10mm BT 184 BGA100T.8-11x11 -
112 11x11
4-Row
0.8mm 10mm FR4 250 LBGA112T.8-DC114 LBGA112T.8C-DC114
144 12x12
Full
0.8mm 12mm FR4 189
198
BGA144T.8-DC128 BGA144T.8C-DC128   360 ° Model
144 13x13
4-Row
0.8mm 12mm FR4 189
198
LBGA144T.8-DC134 LBGA144T.8C-DC134
208 17x17
4-Row
0.8mm 15mm BT 126 BGA208T.8-DC170 BGA208T.8C-DC170
280 19x19
5-Row
0.8mm 17mm FR4 90 LBGA280T.8-DC195 LBGA280T.8C-DC195
532 26x26
7-Row
0.8mm 23mm FR4 60 LBGA532T.8-DC266 LBGA532T.8C-DC266
676 26x26
Full
0.8mm 23mm FR4 60 LBGA676T.8-DC269 LBGA676T.8C-DC269
900 30x30
Full
0.8mm 27mm FR4 40 LBGA900T.8-DC309 LBGA900T.8C-DC309
1225 35x35
Full
0.8mm 31mm FR4 27 LBGA1225T.8-DC359 LBGA1225T.8C-DC359
1444 38x38
Full
0.8mm 32.5mm FR4 24 LBGA1444T.8-DC389 LBGA1444T.8C-DC389
1600 40x40
Full
0.8mm 35mm FR4 21 LBGA1600T.8-DC409 LBGA1600T.8C-DC409
2025 45x45
Full
0.8mm 40mm BT 21 LBGA2025T.8-DC459D LBGA2025T.8C-DC459D
2500 50x50
Full
0.8mm 42.5mm FR4 12 LBGA2500T.8-DC509 LBGA2500T.8C-DC509
3600 60x60
Full
0.8mm 50mm FR4 10 LBGA3600T.8-DC609 LBGA3600T.8C-DC609
For SnAgCu Lead Free solder balls, add  "C" after the pitch.   Example:BGA100T.8C-DC109
Dummy Die: Add  "D" to end of part number.     Example: BGA100T.8-DC109D
Depopulated "perimeter" row versions are available instead of "full" array.
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1.0mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
360° Rotatable
Solidworks
Model
81 9x9
Full
1.0mm 10mm BT 184 BGA81T1.0-ISO BGA81T1.0C-ISO
100 10x10
Full
1.0mm 11mm BT 160 BGA100T1.0 -
144 12x12
Full
1.0mm 13mm BT 160 BGA144T1.0-D
LBGA144T1.0-DC128
LBGA144T1.0C-DC128
156 14x14
4-Row
1.0mm 15mm BT 126 BGA156T1.0-DC140 BGA156T1.0C-DC140
160 14x14
4-Row
2x2 center
1.0mm 15mm BT 126 BGA160T1.0-DC142 BGA160T1.0C-DC142
160 14x14
4-Row
1.0mm 15mm BT 126 BGA160T1.0-DC147A BGA160T1.0C-DC147A
192 16x16
4-Row
1.0mm 17mm BT 90 BGA192T1.0-DC160A BGA192T1.0C-DC160A
196 14x14
Full
1.0mm 15mm BT 126 BGA196T1.0-DC149A BGA196T1.0C-DC149A
196 14x14
Full
1.0mm 15mm BT 126 BGA196T1.0-DC149B BGA196T1.0C-DC149B
208 16x16
4-Row
4x4 center
1.0mm 17mm BT 90 BGA208T1.0-DC164A BGA208T1.0C-DC164A
256 16x16
Full
1.0mm 17mm BT 90 BGA256T1.0-DC169A BGA256T1.0C-DC169A
288 22x22
4-Row
1.0mm 23mm BT 60 BGA288T1.0-DC221 BGA288T1.0C-DC221
324 22x22
4-Row
6x6 center
1.0mm 23mm BT 60 BGA324T1.0-DC224 BGA324T1.0C-DC224
384
(388)
26x26
4-Row
6x6 center
1.0mm 27mm FR4 40 LBGA384T1.0-DC261 LBGA384T1.0C-DC261
388
26x26
4-Row
6x6 center
1.0mm 27mm FR4 40 BGA388T1.0-DC264
BGA388T1.0-D
BGA388T1.0C-DC264
400 20x20
Full
1.0mm 21mm FR4 60 LBGA400T1.0-DC209 LBGA400T1.0C-DC209
484 22x22
Full
1.0mm 23mm FR4 60 LBGA484T1.0-DC229A LBGA484T1.0C-DC229A
672 26x26
Full
1.0mm 27mm FR4 40 eBGA672T1.0-D268D
LBGA672T1.0-DC268
eBGA672T1.0C-D268D
LBGA672T1.0C-DC268
676
26x26
Full
1.0mm 27mm BT 40 BGA676T1.0-DC269 BGA676T1.0C-DC269
900 30x30
Full
1.0mm 31mm FR4 27 eBGA900T1.0-D309D
LBGA900T1.0-DC309
eBGA900T1.0C-D309D
LBGA900T1.0C DC309
1156 34x34
Full
1.0mm 35mm BT 24 BGA1156T1.0-DC349 BGA1156T1.0C-DC349
1600 40x40
Full
1.0mm 42.5mm FR4 12 eBGA1600T1.0-D409D
LBGA1600T1.0-DC409
eBGA1600T1.0C-D409D
LBGA1600T1.0C-DC409
1936 44x44
Full
1.0mm 45mm FR4 12 eBGA1936T1.0-D449D
LBGA1936T1.0-DC449
eBGA1936T1.0C-D449D
LBGA1936T1.0C-DC449
2500 50x50
Full
1.0mm 50mm FR4 10 LBGA2500T1.0-BUS LBGA2500T1.0C-BUS
2500 50x50
Full
1.0mm 52.5mm FR4 10 LBGA2500T1.0-DC509 LBGA2500T1.0C-DC509
10,000 100x100
Full
1.0mm 114mm FR4 4 LBGA10000T1.0-BUS LBGA10000T1.0C-BUS
For SnAgCu Lead Free solder balls, add  "C" after the pitch. Example: BGA256T1.0C-DC169A
Dummy Die: Add  "D" to end of part number.     Example: BGA256T1.0-DC169AD
Depopulated "perimeter" row versions are available instead of "full" array.
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1.27mm Pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
119 7x17
Full
1.27mm 14 x 22mm BT 84 BGA119T1.27-D -
208 17x17
4-Row
1.27mm 23mm BT 60 BGA208T1.27-DC170
BGA208T1.27-DC171
BGA208T1.27C-DC170
BGA208T1.27C-DC171
217 17x17
4-Row
3x3 center
1.27mm 23mm BT 60 BGA217T1.27-DC172
BGA217T1.27-DC174
BGA217T1.27C-DC172
BGA217T1.27C-DC174
256 20x20
4-Row
1.27mm 27mm BT 40 BGA256T1.27-DC200 BGA256T1.27C-DC200
256 16x16
Full
1.27mm 27mm FR4 40 LBGA256T1.27-DC61 LBGA256T1.27C-DC61
272 20x20
4-Row
4x4 center
1.27mm 27mm BT 40 BGA272T1.27-DC202 BGA272T1.27C-DC202
313 25x25
Staggered
1.27mm 35mm BT 24 BGA313T1.27 BGA313T1.27C
352 26x26
4-Row
1.27mm 35mm BT 24 BGA352T1.27-DC70 BGA352T1.27C-DC70
357 19x19
Full
1.27mm 25mm FR4 44 LBGA357T1.27-DC73 LBGA357T1.27C-DC73
388 26x26
4-Row
6x6 center
1.27mm 35mm BT 24 BGA388T1.27-DC72
BGA388T1.27-DC265
BGA388T1.27C-DC72
BGA388T1.27C-DC265
1225 35x35
Full
1.27mm 45mm FR4 12 eBGA1225T1.27-D359D
LBGA1225T1.27-DC359
eBGA1225T1.27C-D359D
LBGA1225T1.27C-DC359
6,400 80x80
Full
1.27mm 114mm FR4 4 - LBGA6400T1.27F-BUS
LBGA6400T1.27C-BUS
For SnAgCu Lead Free solder balls, add  "C" after the pitch. Example: BGA256T1.27C-DC200
Dummy Die: Add  "D" to end of part number.     Example: BGA256T1.27-DC200D
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SBGA - Thermally Enhanced 1.27mm Pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
256 20x20
4-Row
1.27mm 27mm BT 40 SBGA256T1.27-DC200 SBGA256T1.27C-DC200
304 23x23
4-Row
1.27mm 31mm BT 27 SBGA304T1.27-DC230 SBGA304T1.27C-DC230
352 26x26
4-Row
1.27mm 35mm BT 24 SBGA352T1.27-DC70 SBGA352T1.27C-DC70
432 31x31
4-Row
1.27mm 40mm BT 24 SBGA432T1.27-DC314 SBGA432T1.27C-DC314
480 29x29
5-Row
1.27mm 37.5mm BT 21 SBGA480T1.27-ISO SBGA480T1.27C-ISO
560 33x33
5-Row
1.27mm 42.5mm BT 12 SBGA560T1.27-DC87 SBGA560T1.27C-DC87
600 35x35
5-Row
1.27mm 45mm BT 12 SBGA600T1.27-D
SBGA600T1.27-DC355
SBGA600T1.27C-DC355
1517 39x39
Full
1.0mm 40mm BT 21 SBGA1517T1.0-D -
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: SBGA256T1.27C-DC200
Dummy Die: Add  "D" to end of part number.     Example: SBGA256T1.27-DC200D
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PBGA - 1.5mm pitch
Balls Ball Matrix Pitch Size (mm) Substrate Tray Qty SnPb
Standard
SnAgCu
Lead Free - RoHS
169 13x13
Full
1.5mm 23mm BT 60 BGA169T1.5-DC10 BGA169T1.5C-DC10
225 15x15
Full
1.5mm 27mm BT 40 BGA225T1.5-DC15 BGA225T1.5C-DC15
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: BGA169T1.5C-DC10
Dummy Die: Add  "D" to end of part number.     Example: BGA169T1.5-DC10D
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CBGA - Ceramic Ball Grid    Standard=Sn10=Hi Temp,     L=Sn62=Low Temp,    C=Sn96.5/Ag3.0/Cu0.5
Balls Ball Matrix Pitch Size (mm) Tray Qty Bare Substrate
Without Balls
For CCGA
Hi-Temp SnPb
Low-Temp SnPb
Lead Free
Pb-Free (RoHS)
121 11x11
Full
1.27mm 15mm 119/126 CLGA121T1.27A-DC5
Pt-Ag95
CBGA121T1.27-DC5
Sn10/Pb90

CBGA121T1.27L-DC5
Sn62/Pb36/Ag2.0
CBGA121T1.27C-DC5
Sn96.5/Ag3.0/Cu0.5
196 14x14
Full
1.27mm 18.5mm 84 CLGA196T1.27A-DC11
Pt/Ag95
CBGA196T1.27-DC11
Sn10/Pb90

CBGA196T1.27L-DC11
Sn62/Pb36/Ag2.0
CBGA196T1.27C-DC11
Sn96.5/Ag3.0/Cu0.5
256 16x16
Full
1.27mm 21mm 60 CLGA256T1.27A-DC61
Pt/Ag95
CBGA256T1.27-DC61
Sn10/Pb90

CBGA256T1.27L-DC61
Sn62/Pb36/Ag2.0
CBGA256T1.27C-DC61
Sn96.5/Ag3.0/Cu0.5
304 16x19
Full
1.27mm 21 x 25 55 CLGA304T1.27A-DC63
Pt/Ag95
CBGA304T1.27-DC63
Sn10/Pb90

CBGA304T1.27L-DC63
Sn62/Pb36/Ag2.0
CBGA304T1.27C-DC63
Sn96.5/Ag3.0/Cu0.5
361 19x19
Full
1.27mm 25mm 44 CLGA361T1.27A-DC71
Pt/Ag95
CBGA361T1.27-DC71
Sn10/Pb90

CBGA361T1.27L-DC71
Sn62/Pb36/Ag2.0
CBGA361T1.27C-DC71
Sn96.5/Ag3.0/Cu0.5
400 20x20
Full
1.27mm 27mm 40 CLGA400T1.27A-DC21
Pt/Ag95
CBGA400T1.27-DC21
Sn10/Pb90

CBGA400T1.27L-DC21
Sn62/Pb36/Ag2.0
CBGA400T1.27C-DC21
Sn96.5/Ag3.0/Cu0.5
625 25x25
Full
1.27mm 32.5mm 24 CLGA625T1.27A-DC81
Pt/Ag95
CBGA625T1.27-DC81
Sn10/Pb90
CBGA625T1.27C-DC81
Sn96.5/Ag3.0/Cu0.5
1089 33x33
Full
1.27mm 42.5mm 12 CLGA1089T1.27A-DC339
Pt/Ag95
CBGA1089T1.27-DC339
Sn10/Pb90
CBGA1089T1.27C-DC339
Sn96.5/Ag3.0/Cu0.5
For SnAgCu Lead Free solder balls, add  "C" after the pitch.     Example: CBGA256T1.27C-DC61
Dummy Die: Add  "D" to end of part number.     Example: CBGA256T1.27-DC61D
CBGA Substrate: 1.0mm (40mils) thick. Composition 96% Alumina, 4% Talc, 1600°C. Fired   CTE 6.7 x 10-6/°C
Large Size CBGA Delamination CTE mismatch warning.
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Notes About Substrates
BT Versus FR4
Flex Polyimide Versus BT

Download our dummy components catalog in PDF format.

        
 
 
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