Column Attachment Tool Set CCGA624A Package   Catalog   •   Video  •   Packages  •   Library   •   Process   •   Columns   •   Stencil   •   Printer   •   Tray   •   Align   •   Planar   •   Vacuum   •   More Tools   •   Flip-Pack® Column Attachment Tools for Solder Columns About Tool-Kit: TopLine manufactures a complete set of precision tools to attach Solder Columns and Micro-coil Springs to your specific CCGA column grid array package. Our tools hold cylindrical solder columns or micro-coil springs vertically at true 90° during the entire assembly process. Use our tool-kit to columinize a fresh LGA or rework a damaged CCGA for full-use deployment. The tool-kit includes a benchtop graphite set and accessories such as a vacuum chuck, alignment template, insertion tool, extraction tool and solder paste printer for a professional job. Simple column attachment process steps using new Flip-Pack® Package Specifications: Pins: 624 Pitch: 1.27mm Size X/Y: 32.5 x 32.5mm Size Z: Substrate 2.25mm / With Lid ~2.7mm Substrate: Ceramic Column Length: 2.21mm After Planarizing Column Diameter: Ø0.50mm Maker: Microchip (Microsemi/Actel) Drawings:  CLGA624  •  CCGA624  •  CCGA624A Top Bottom C7 Series TOOL-KIT REQUIRED ITEMS Tool DWG Model Description Image GRAPHITE SET 722580 C7-TOP-624-A Graphite structure with array of holes to match CCGA pads. Holds columns upright. Bottom side has downset to clear solder paste fillets. Top side has receptacle to accept optional Flip-Pack® U.S. Patent D808350 S. 532220 C7-STAGE-624-A Adjustable X/Y stage holds and aligns LGA/CCGA substrate pads. Channels permit optional thermocouples to measure temperature at substrate during reflow. Vacuum center hole prevents substrate from lifting. U.S. Patent D908648 S. 550000 C7-BASE Base has ultra-fine threaded adjustment to align the stage in X/Y directions. Includes 3 precision alignment pins. The C7-BASE sits on top of vacuum chuck to secure the substrate in the stage. Patent pending. TAMPING TOOL 422580 C7-TAMP-624-A Array of Titanium (Ti) pins gently pushes solder columns uniformly into solder paste on substrate. EXTRACTION TOOL 703258 C7-EXTRACT-624-A Precision dowel pins safely lifts CCGA substrate by 4-corners from the Graphite top plate after reflow. ALIGNMENT 222542 C7-ALIGN-624-A Essential tool for centering and accurate X/Y Theta alignment of LGA in graphite. Includes precision alignment template with aperture allowing annular ring vision of LGA pads while seated in graphite. PASTE STENCIL 622548 8 Mil Set C7-STENCIL-624-A Set of laser cut stainless steel stencils with a choice of apertures for optimizing solder paste volume. Micro-etched stencil surface with nano-coating assures clean solder paste deposits to LGA seated in Graphite Set. STENCIL PRINTER 700000 C7-PRINTER Simple to use manual stencil printer for applying solder paste while LGA sits in graphite. Adjustable spring back for clean solder paste deposits. Includes stainless steel stencils and metal doctor blade squeegee. PLANARIZING 700258 C7-PLANAR-624-A Securely holds and protects CCGA while planarizing Solder Columns using fine-grit silicon carbide lapping media and diamond polishing film of your selection. Includes precision machined brass plate and two step shims. Not required for Micro-coil springs. 702258 C7-EJECT-624-A Simple to use tool to extract CCGA from Planarizing tool. Gently lifts substrate at 4-corners with precision dowel pins.   Note 1: Consult with TopLine for recommended tools for your application.       C7 Series Tools RECOMMENDED OPTIONAL ACCESSORIES Tool Series Model Description Image FLIP PACK® Filled: 832250 832254 902250 Empty: 002250 Filled with Columns: FP83C624F20x91A FP83C624F20x93A FP90U624F20x91A Empty: FP624A Flip-Pack® pre-loaded cassette with Columns or Springs arranged in the correct array for quick assembly. Deposits columns into graphite in one-minute. Optionally re-fillable by customer or by recycling to TopLine. U.S. Patent 9,629,259 INSERT TOOL 700087 C7-INSERT-FP2-87 Provides easy loading of Flip-Pack® into Graphite TRAY BOX 932259 EC1-624F-2BC Protective Tray Box for safe transport and storage of single CCGA device with columns. ESD safe.         Model Numbering System     C7     -     TOOLSET     -     624     -     A     Series   Description   Columns   Variations Attachment Tool Series   •   Description C7 = CCGA tool-set   Tool Type NAME • Description GRAPHITE STAGE BASE TOP TAMP EXTRACT STENCIL PRINTER ALIGN PLANAR   Columns Code • Nbr. Pads 624 = 624 pins Contact TopLine Other Pins   SET Code • Version A • Version A B • Version B C • Version C Other Version Available     Drawing Number System       7         2         25         80     Series Pitch or Size Tool Number Version C7 Tool-set Code • Item Description 2 = Alignment Reticle 3 = Interposer with Columns 4 = Titanium Tamping Tool 5 = Graphite X/Y Stage 6 = STENCIL (Solder Paste) 7 = Graphite Set & Accessories 8 = See Flip Pack 9 = Graphite Top Plate GRAPHITE SET Code • Pitch 1 = 1.0mm   2 = 1.27mm 4 = 0.4mm   5 = 0.5mm   6 = 0.65mm 8 = 0.8mm   9 = Special  0 = Special  GRAPHITE STAGE Code • X/Y Size 32 = 32.5x32.5 GRAPHITE SET Code • Matrix 25 = 25x25 Graphite STAGE Code • LGA (Z) Thick 22 = 2.2mm Ceramic GRAPHITE SET Code • Ø Column Diameter • Version 1# = Ø6 mil •   Ø0.15mm • Cu Wire 2# = Ø8 mil •   Ø0.20mm • Cu Wire 3# = Ø10 mil • Ø0.25mm • Cu Wire 4# = Ø12 mil • Ø0.30mm • Column 5# = Ø15 mil • Ø0.38mm • Column 6# = Ø16 mil • Ø0.40mm • Spring 7# = Ø20 mil • Ø0.50mm • Spring 8# = Ø20 mil • Ø0.50mm • Column 9# = Ø22 mil • Ø0.56mm • Column GRAPHITE STAGE Code • Version 0~9 = Rev A~J TITANIUM TAMPING TOOL Code • Version #0~#9 = Rev A~J       ECCN: EAR99 Export Administration Regulations (EAR) HS Code: 8542.90.0000 ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLY PARTS ITAR: Micro-coil springs and dummy daisy chain CCGA are not restricted.     Download Solidworks® e-Drawing viewer to enjoy 360° rotatable models.   TopLine Corporation 95 Highway 22 W Milledgeville, GA 31061, USA Toll Free USA/Canada (800) 776-9888 International: 1-478-451-5000 Email: sales@topline.tv ©2024 TopLine. 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