Heat Spreader
for BGA and CCGA
 
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ABOUT Heat Spreaders:

"HAT" shaped or flat Heat Spreaders are made from Nickel Plated Copper Alloy for BGA packages. Copper heat spreaders are attached directly to the top of the chip package using a thermal interface material (TIM) such as SE 4450 Adhesive.

AlSiC Heat Spreaders are made of aluminum mixed with Silicon-Carbide particles for CCGA packages. This combination results in a low CTE composite that is able to dissipate heat generated by the die on ceramic CCGA packages. AlSiC have high thermal conductivity and low thermal expansion compatible with semiconductor silcon chips and ceramic substrates enabling higher performance to prevent fatigue failure. The AlSiC heat spreader is attached directly to the top of the power chip using a thermal interface material (TIM) such as SE 4450 Adhesive. The thermal conductivity rate of AlSiC permits chip heat to be distributed evenly with higher performance for reliability and stability. AlSiC-8 material composition is 37% volume of Al and 63% volume of SiC. The heat sink is plated with electroless nickel (Ni) 4~8 um (157~315 micro-inch) thickness.
 
 
 
H-CAP Series "HAT" Copper Dome Shaped Heat Spreader for BGA
TOP BOTTOM
DWG BGA Size (mm) Total
Height
Die
Height
Part Number Die Size
Max
Material SolidWorks
Model
211710 11 x 11mm
10.8x10.8mm
1.3mm 0.85mm H-CAP11A 6x6mm Cu Alloy Model
213710 13 x 13mm 1.38mm 0.88mm H-CAP13A 8x8mm Cu Alloy Model
217710 17 x 17mm 1.3mm 0.8mm H-CAP17B 11x11mm Cu Alloy Model
219710 19 x 19mm 1.3mm 0.8mm H-CAP19A 13x13mm Cu Alloy Model
221710 21 x 21mm 1.3mm 0.8mm H-CAP21A 15x15mm Cu Alloy Model
223710 23 x 23mm 1.3mm 0.8mm H-CAP23A 17x17mm Cu Alloy Model
225710 25 x 25mm 1.3mm 0.8mm H-CAP25A 18x18mm Cu Alloy Model
227710 27 x 27mm 1.3mm 0.8mm H-CAP27A 19x19mm Cu Alloy Model
229710 29 x 29mm 1.3mm 0.8mm H-CAP29A 21x21mm Cu Alloy Model
231710 31 x 31mm 1.3mm 0.8mm H-CAP31A 23x23mm Cu Alloy Model
235710 35 x 35mm 1.3mm 0.8mm H-CAP35B 25x25mm Cu Alloy Model
237710 37.5 x 37.5mm 1.3mm 0.8mm H-CAP37.5A 27x27mm Cu Alloy Model
240711 40 x 40mm 1.3mm 0.8mm H-CAP39.6B 29x29mm Cu Alloy Model
240710 40 x 40mm 1.3mm 0.8mm H-CAP40A 30x30mm Cu Alloy Model
242710 42.5 x 42.5mm 1.3mm 0.8mm H-CAP42.5A 32x32mm Cu Alloy Model
245710 45 x 45mm 1.85mm 0.85mm H-CAP45A 35x35mm Cu Alloy Model
247710 47.5 x 47.5mm 1.85mm 0.85mm H-CAP47.3A 37x37mm Cu Alloy Model
250710 50 x 50mm 1.8mm 0.8mm H-CAP50A 36x36mm Cu Alloy Model
252710 52.5 x 52.5mm 1.8mm 0.8mm H-CAP52.5A 38x38mm Cu Alloy Model
255710 55 x 55mm 1.8mm 0.8mm H-CAP55B 41x41mm Cu Alloy Model
260710 60 x 60mm 1.8mm 0.8mm H-CAP60A 42x42mm Cu Alloy Model
Base Material: Cu Copper Alloy UNS C10200 or C11000. Half-Hard. Oxygen Free
Plating: Nickel (Ni) 5um Min. Semi-Finish
Vent Hole: For vented BGA
 
 
 
F-CAP Series "Copper" FLAT Cavity Heat Spreader for BGA
TOP BOTTOM
DWG BGA Size (mm) Total
Height
Die
Height
Part Number Style Material SolidWorks
Model
210790 10 x 10mm 1.6mm 0.8mm F-CAP10A Flat Cavity Lid Cu Alloy Model
242790 42.5 x 42.5mm 1.6mm 0.8mm F-CAP42.5A Flat Cavity Lid Cu Alloy Model
252790 52.5 x 52.5mm 1.6mm 0.8mm F-CAP52.5A Flat Cavity Lid Cu Alloy Model
Base Material: Cu Copper Alloy UNS C10200 or C11000. Half-Hard. Oxygen Free
Plating: Nickel (Ni) 5um Min. Semi-Finish
Custom sizes available.
 
 
 
 
CN Series "AlSiC" Heat Spreader Cover for CCGA
  
DWG CCGA Size (mm) Max Die Height Part Number Supports Material SolidWorks
Model
111310 31mm 1.95mm CN-CAP31A 4-Corner Posts AlSiC Model
111320 32.5mm 1.95mm CN-CAP32A 4-Corner Posts AlSiC Model
111350 35mm 1.95mm CN-CAP35A 4-Corner Posts AlSiC Model
111370 37.5mm 1.95mm CN-CAP37A 4-Corner Posts AlSiC Model
111400 40mm 1.95mm CN-CAP40A 4-Corner Posts AlSiC Model
111420 42.5mm 1.95mm CN-CAP42A 4-Corner Posts AlSiC Model
111450 45mm 1.95mm CN-CAP45A 4-Corner Posts AlSiC Model
111520 52.5mm 1.95mm CN-CAP52A 4-Corner Posts AlSiC Model
111000 All 1.95mm CN-CAP ALL 4-Corner Posts AlSiC Model
 
 
 
 
CF Series "AlSiC" Flat Style Heat Spreader Cover for CCGA
  
DWG CCGA Size (mm) Heatspreader
Thickness
Part Number Style Material SolidWorks
Model
112033 35 x 35mm 1.0mm CF4-CAP33C Flat Lid
Cloverleaf Design
AlSiC Heatspreader Model

Attached to
CCGA Model
 
 
 
 
MATERIAL SPECIFICATIONS
Material Density
g/cm3
CTE
ppm/oC
[25~150°C]
Youngs
Modulus
GPa
Thermal
Conductivity
W/mK @25°C
Fracture
Toughness
MPa*m1/2
Mohs Scale
of Hardness
Bending
Strength
AlSiC-8
37% Vol Al
63% Vol SiC
2.83 8~9 188 170~189 8 8~9 3200
UNS C10200
Copper Alloy
8.9 17 115 400 - - -
 
 
 
Recommended Thermally Conductive
SE 4450 Adhesive
for Attaching Heat Spreaders to Ceramic Substrates
 
 
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