Pitch Selection Chart
Pin Pitch
Cross Reference
 
Available Dummy Components by Pin Pitch (Spacing between Leads - center to center)

 
Pick a Dummy

Flip Chip
Package
Device
0.152mm
152µm
0.204mm
204µm
0.254mm
254µm
0.457mm
457µm
          Image
Flip Chip - - - - - Flip Chip Bumped Die
 
 
BGA - CSP - WLP - WLCSP - Area Arrays
Package
Device
0.3mm
300µm
0.4mm
400µm
0.5mm
500µm
0.65mm
650µm
0.75mm
750µm
0.8mm
31.5mil
1.0mm
40mil
1.27mm
50mil
1.5mm
59mil
Image
BGA - BGA - Ball Grid Array
WL-CSP - - - - - - WL-CSP - Wafer Level - Chip Scal Package
 
 
Dual Side - Lead Frame Packages
Package
Device
0.3mm
11.8mil
0.4mm
15.7mil
0.5mm
19.7mil
0.635mm
25mil
0.65mm
25.6mil
0.8mm
31.5mil
1.0mm
40mil
1.27mm
50mil
Image
DFN - - - - DFN - Dual Flat No Lead
FP
Flat Pack
- - - - - - FP - Flat Pack - Dual Side
HSOP - HSOP - Highpower Small Outline Package
MSOP - - - - - - MSOP - Mini Small Outline Package
QSOP - - - - - - - QSOP - Quarter Small Outline Package
QVSOP - - - - - - QVSOP - Quarter Very Small Outline Package
SO, SOIC
SOM, SOL, SOP
- - - - - - - SO - Small Outline
SOJ - - - - - - - SOJ - Small Outline J-Lead
SSOP - - - - SSOP - Shrink Small Outline Package
TSOP T1 - - - - - - - TSOP - Thin Small Outline Package - Leads on narrow end
TSOP T2 - - - - TSOP - Thin Small Outline Package - Leads on wide side of body
TSSOP - - - - - TSSOP - Thin Small Outline Package
 
 
Quad Side - Lead Frame Packages
Package
Device
0.3mm
11.8mil
0.4mm
15.7mil
0.5mm
19.7mil
0.635mm
25mil
0.65mm
25.6mil
0.8mm
31.5mil
1.0mm
40mil
1.27mm
50mil
Image
BQFP - - - - - - - BQFP - Bumper Quad Flat Pack
CERQUAD - CERQUAD-Ceramic Quad Flat Pack
CQFP - CQFP - Ceramic Quad Flat Pack
CLCC - - - - - - - CLCC - CQFJ, JLCC, JLDCC J-Lead Ceramic Leaded Chip Carrier
LCC - - - - LCC - Leadless Chip Carrier
LQFP - - LQFP - 1.4mm thick Low Quad Flat Pack
MQFP - - - MQFP - Metric Quad Flat Pack
PLCC - - - - - - - PLCC - J-Lead Plastic Leaded Chip Carrier
PQFP - - - PQFP - Plastic Quad Flat Pack
QFP - - - QFP - Quad Flat Pack
QFN - - - - QFN - Quad Flat No Lead
QFP - - - QFP - Quad Flat Pack
TQFP - - TQFP - thick Thin Quad Flat Pack
 
 
Throughhole Packages
Package
Device
1.0mm
40mil
1.27mm
50mil
1.78mm
70mil
2.54mm
100mil
5.08mm
0.2-inch
6.35mm
0.25-inch
7.5mm
0.3-inch
10mm
0.4-inch
15mm
0.6-inch
Image
DIL - - - - - - - - DIL - Dual In Line
DIP - - - - - - - - DIP - Dual Inline Package
PDIP - - - - - - - - PDIP - Plastic Dual Inline Package
SDIP - - - - - - - - SDIP - Skinny Dual Inline Package
SIP - - - - - - - SIP - Single Inline Package
Radial
Capacitor
- Cap - Capacitor
 
 
Contact TopLine for other package types available.

Top of Page    View By Products Type



TopLine Corporation
95 Highway 22 W
Milledgeville, GA 31061, USA
Toll Free USA/Canada (800) 776-9888
International: 1-478-451-5000  •  Fax: 1-478-451-3000
Email: sales@topline.tv

Home